What is the internal structure of a fanless industrial computer

Fanless industrial computer is a branch of industrial computer. In terms of CPU power consumption and heat dissipation, fanless passive heat dissipation is mainly used. Every industrial computer manufacturer has different manufacturing processes, and the internal structure of fanless industrial computers is also different, but the overall structure is similar. The editor takes the CESIPC industrial computer as an example to dissect the internal structure of the fanless industrial computer.

Start from the motherboard of the industrial computer

The basic characteristics of an industrial computer are the same as those of a computer. There will be motherboards, central processing units (CPU), memory, hard drives (mechanical hard drives, solid state drives) and other peripheral interfaces, adapter boards (PCI, PCIe, Mini PCIe), etc. If you have an understanding of the hardware, a large part of the current processors in China are purchased from foreign countries. Few domestic manufacturers can produce processors with the same performance and stability as Intel, so today I am talking about motherboards that will weaken the processor. This level.

The size of the motherboard

Industrial computer motherboards are not the same in size, the performance developed by each manufacturer is different, and the size is also different. For fanless industrial computers, the size is miniaturized. At present, the size of industrial motherboards produced by many manufacturers is 3.5 inches. Of course, there are also different The customer makes it.

PCB design of the motherboard

In the electronic design of industrial computer motherboards, PCB boards with 6 layers or more are generally used for production. These designs are based on different customer application scenarios. The popular industrial motherboards on the market are PCB boards with 4-6 layers. (Main signal layer, ground layer, power layer, secondary signal layer, auxiliary power layer, middle signal layer).

In order to improve performance stability, meet the needs of various industrial applications, and conform to the development trend of the Internet of Things in the future, the editor understands that the main board of the CESIPC industrial computer adopts a PCB main board with a layer of 8-10 or more, which will increase the design. A primary signal layer, ground layer, power layer and secondary signal layer.

Electronic materials for motherboards

A large part of the stability of industrial motherboards is derived from the electronic materials of a motherboard. For example, memory, hard disk, capacitors, resistors, electrical isolation and other resistors are used by different manufacturers and standards. These all determine that the use environment of the industrial computer supports wide temperature and stable operation, and is not afraid of low temperature, high temperature, and high vibration. The risks posed by the environment.

Peripheral I/O interface of the motherboard

An industrial computer is different from an ordinary computer. Because an industrial computer is a rich external device for docking, it is necessary to design a rich I/O interface. For example, multiple USB, multiple network ports, multiple COM ports, and HDMI/VGA ports for display. Industrial-grade I/O interface provides isolation protection, which can meet the maximum flexibility requirements under the premise of ensuring design efficiency.

Motherboard provides isolation protection

The application of industrial motherboards is different. In order to effectively protect the equipment, industrial motherboards will provide isolation protection during design. It can support functions such as power management function, call self-start, watchdog, etc., so that customers can quickly integrate, and can also provide customers with personalized customized services.

Industrial computer structure

The performance of the industrial computer is good or bad, in addition to the main board material, there are also great requirements for the structural design of the whole machine. From performance optimization, heat dissipation design, complete machine sealing design, etc., it is related to the stability and reliability of an industrial computer.

Heat dissipation structure

In terms of heat dissipation of fanless industrial computer, the industrial computer with attitude on the market adopts passive heat dissipation. The whole machine adopts industrial chassis made of high-strength oxidized aluminum alloy and 304 stainless steel baffle. It has the ability to resist strong electromagnetic interference and has a large area of ​​heat dissipation aluminum. The profile fins can efficiently dissipate heat and have a high-sealing design, which can be dustproof, anti-vibration, high temperature and low temperature resistance, and ensure that the industrial computer can operate stably in a wide temperature environment.

Wiring flexibility

We know that the general requirement for industrial computer is that the fewer lines the better. But for the flexibility of assembly and for more speed, the industrial computer produced by the company with certain research and development strength adopts modular design.

But no company is completely cable-free. At this time, the structure of the fanless industrial computer is more or less wired. The flexibility of wiring also determines the diversity of a company’s business, which can provide customized development and customized services for customers.

The structure of the fanless industrial computer is roughly as described above. The structure of the industrial computer directly affects the performance of an industrial computer. If you want to learn more about fanless industrial computers, you can follow me and share the first-line factory production of industrial computers later. the whole process.

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